Assembly & Packaging
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| VLSI & MEMS Packaging facility operating in
Class 100 and Class 10000 Clean Rooms includes Die Bonders, Ball & Wedge Wire Bonders, Multi-Zone Furnaces for Hermetic Sealing, Multi-Function Bond Pull Testers, Laser Welder, Dicing Saw, Tape Mounter etc.
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Key Capabilities :
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Fine Pitch Bonding capability for pad size of 57µmx57µm and 65µm pitch | |
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Capability of developing customised ceramic packages to address signal integrity and reliability issues for ASICs in 180nm Process | |
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Low Temperature Process for packaging large dies | |
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Multi-Chip Packaging Process for ASICs and sensor devices | |
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MIC Packaging |
